Incorrect pin mapping, an inaccurate PCB footprint, or poor soldering on a small RF/coaxial connector can cause intermittent signals, mechanical failure, or board scrap. This guide provides concise, testable steps to verify pin mapping, validate footprints, and execute reliable soldering to meet first-pass yield targets. Background: Pre-Verification Essentials (414046-2 Overview) Quick Spec Checklist Point: Gather minimum datasheet items before layout. Evidence: Datasheets list contact count, pin numbering, shell connections, mounting type, RF impedance, and solder type. Explanation: Maintaining a one-page checklist avoids drawing discrepancies and ensures schematic/footprint alignment. Variant Footprint Pitfalls Point: Suffixes and mounting options significantly change dimensions. Evidence: Bulkhead vs. PCB-mounted styles alter clearances and keepout zones. Explanation: Compare mechanical drawings to CAD models, focusing on datum references and plating thickness notes. How to Verify the Pinout Desk Verification Cross-check datasheet pins against schematic nets. Identify reference views (front/back) and document shield/ground references to prevent mirrored pins in the CAD lifecycle. Lab Verification Confirm mapping with bench tests. Use a multimeter for shell-to-ground continuity and verify signal pin integrity. For RF, supplement with S-parameter checks if a VNA is available. Functional Test Matrix (Typical Values) Verification Step Target Metric Pass Criteria Shield Continuity Resistance (Ω) Signal Isolation Isolation (MΩ) > 500 MΩ RF Impedance TDR / VNA 50 Ω ± 5% Confirming the Footprint and PCB Layout Mechanical to PCB Translation Convert drawing callouts into pads and keepouts. Interpret units/datum, specify drill sizes with tolerances, and set solder mask openings. Avoid common mistakes like mirrored footprints or incorrect hole plating assumptions. Critical Check: Use calipers and a 3D STEP model to cross-check coordinates before finalizing the layout. 3D Clearance & Prototyping Fit Precision 98% Import the connector STEP model into the board mechanical layer. Run collision checks with enclosures and nearby components to ensure production readiness. Soldering Tips and Process Recommendations Method Selection Match soldering to connector thermal mass. Low-mass pins handle reflow well, while bulky shells may require selective soldering or hand-tacking to protect mechanical integrity. Joint Inspection Good joints exhibit full wetting and proper fillets. Use microscopes or X-rays for hidden joints. Avoid cold fillets or insufficient solder which lead to intermittent failures. "Recommended: Use neutral or slightly activated flux and control thermal profiles (preheat/peak) to ensure reliable long-term performance." Pre- & Post-Assembly Validation Pre-Assembly: Verify part orientation, ESD precautions, solder paste stencil alignment, and fixture availability. Use a Go/No-Go checklist for incoming inspection. Post-Assembly: Perform electrical continuity tests, mechanical pull/torque checks, and functional RF measurements. Redesign footprints if recurring alignment issues appear. Summary Verify connector pin mapping against datasheets through bench tests; convert mechanical drawings into validated footprints via 3D fit checks; and apply appropriate soldering methods to ensure production-ready joints. Engineers must validate parts before production to minimize scrap and rework. Pin Mapping Footprint Validation Soldering Best Practices FAQ How should engineers verify a connector pinout before assembly? Start with a desk cross-check: identify the reference view in the datasheet, map pins to schematic nets, and annotate shield/ground. Then perform bench continuity tests on sample parts using a multimeter and a simple jig. Document expected results for reproduction during inspection. What are the most common footprint errors and how can they be avoided? Common errors include mirrored footprints, wrong datum usage, incorrect drill/tolerance choices, and omitted keepouts. Avoid them by translating datum references carefully, using the STEP model for 3D checking, and ordering a small prototype run to confirm fit. When is hand soldering acceptable versus reflow or selective soldering? Hand soldering works for low-volume prototypes and connectors with limited thermal mass. Reflow is best for SMT-compatible connectors with controlled profiles. Selective soldering suits through-hole connectors in mixed assemblies. Always control thermal exposure to protect internal components.

BNC Jack Specifications: Comprehensive 50Ω Performance Guide 50 Ω BNC jacks remain a de facto standard on RF test benches and many instrumentation products—commonly specified for reliable performance up to ~4 GHz. Engineers evaluating connectors focus first on impedance control, return loss (S11), insertion loss (S21), and mechanical durability. This guide translates electrical and mechanical specifications into actionable selection, test, and integration advice for engineers and technicians. It concentrates on practical spec interpretation, measurement best practices, PCB integration, and common failure modes so teams can specify, test, and procure connectors that meet system-level needs without guesswork. Quick Reference: Essential BNC Jack Specifications What to list on a spec sheet Point: A concise spec sheet prevents ambiguity during procurement and test. Evidence: Every sheet should state nominal impedance (50 ohm), frequency range, VSWR/return loss, insertion loss, DC voltage rating, RF power handling, contact and insulation resistance, mating cycles, temperature range, materials/plating, and mounting type. Explanation: These fields allow cross-checks against S-parameter files and help buyers request guaranteed limits instead of typical curves. Field Typical Guaranteed Units Notes Nominal Impedance 50 50 ± 2 ohm Measured 100 MHz–4 GHz Frequency Range DC–4 DC–4 GHz See S-parameter appendix VSWR (max) 1.15 ≤1.3 ratio Mated, reference plane defined Electrical Performance: Impedance, Return Loss, and Frequency Behavior Impedance Matching Point: Strict 50 ohm control minimizes reflections and preserves power transfer. Evidence: Mismatch sources include connector geometry, PCB transition discontinuities, and dielectric permittivity variance. Explanation: Specify impedance tolerance (e.g., 50 ± 2 ohm) and require measured TDR or S11-derived impedance plots. S-Parameter Analysis Point: S-parameter curves convey usable bandwidth and mismatch severity. Evidence: Target return loss better than 14 dB (S11 Explanation: Include measurement conditions (SOLT/TRL calibration) and clearly mark the reference plane. Visualization: S-Parameter Magnitude Performance 0.1 GHz -40 dB | -0.1 dB 1.0 GHz -22 dB | -0.2 dB 2.0 GHz -16 dB | -0.5 dB 4.0 GHz -12 dB | -1.0 dB Legend: Bar width represents relative signal integrity (Left: S11 | Right: S21) Frequency Limits, Power Handling & Electrical Ratings Usable Frequency Ranges Usable frequency depends on mechanical tolerances and dielectrics. Most 50 ohm BNC jacks are rated to 4 GHz. Above that, geometry and surface finish dominate performance. Voltage & Transient Safety Specify DC and RF limits alongside peak transient handling. Require derating curves versus frequency and temperature for high-ambient applications. Mechanical & Materials Specifications Materials: Conductive bodies and contacts with high conductivity (Gold plating) reduce loss. Dielectrics: Stable permittivity (e.g., PTFE) ensures consistent impedance. Durability: Specify mating cycles (500–1,000) and panel nut torque requirements. Environment: Account for IP ratings, vibration, and thermal cycling reliability. Plating Integrity Contact plating thickness directly correlates with signal longevity and wear resistance. Design Integration & PCB Layout Footprint Best Practices Use a controlled microstrip/stripline transition. Place a perimeter ground via fence to minimize EMI. Avoid ground windows that create step discontinuities in impedance. Mitigation: Specify mating cycles and corrosion-resistant plating to prevent mechanical failures over time. PCB Schematic View Pad [Gnd ring] ● via● via ● via● via Summary (Actionable Takeaways) Specify impedance and S-parameter guarantees, not just typical plots, to ensure true 50 ohm behavior. Request calibrated S-parameter files (S2P) with defined reference planes for meaningful comparisons. Include mechanical durability (mating cycles, plating, mounting) to avoid early deployment failures. Adopt standardized lab procedures (SOLT/TRL) and document pass/fail thresholds for qualification. Frequently Asked Questions What are the key 50 ohm specifications to request for a BNC jack? + Request nominal impedance with tolerance, frequency range, VSWR limits, insertion loss, DC/RF power ratings, contact/insulation resistance, mating cycle rating, and the availability of S2P files. How should I specify return loss (S11) for instrument-grade connectors? + Specify a guaranteed S11 limit (e.g., ≤ −14 dB or VSWR ≤ 1.3) across the operating band. Require specific test methods and calibration types to ensure unit-to-unit consistency. What PCB footprint practices preserve 50 ohm transitions? + Use controlled impedance stack-up, match pad geometry to the manufacturer’s footprint, place ground vias for return paths, and use mechanical anchoring to protect impedance from stress.

Background: Understanding 413586-1 Specifications Definition and Application Scope 413586-1 is a part/specification designation used in maintenance documentation to identify a required grease formulation for a specific component or assembly. It commonly appears in technical manuals for heavy-industrial bearings, actuator pivots, and landing-gear type assemblies where controlled lubrication properties are essential. Service technicians should consult the applicable maintenance manual or specification sheet to confirm the intended application, performance envelope, and any listed limitations before considering substitutions. Risk Drivers in Grease Replacement Substituting without a proper cross-reference risks chemical incompatibility, thickener breakdown, additive depletion, and contamination. Consequences include accelerated bearing fatigue, higher operating temperatures, lubrication starvation, and potential safety incidents. Warranty and maintenance records may be voided when undocumented substitutions occur. A formal cross-reference process mitigates these risks by matching critical properties rather than relying on superficial similarity. Cross-Reference Technical Tolerance Standards Base Oil Viscosity Tolerance: ±20% cSt @ 40°C NLGI Consistency Tolerance: Within 1 Grade Chemistry Match Tolerance: Zero Variance (Thickener) Safety & Compliance Considerations Manufacturer Guidance Review the maintenance manual, OEM limits, and safety advisories before replacement. Verify maximum operating temperature and sealed-system requirements. Always perform a full purge of old grease when specifications mandate it to avoid unstable blends. PPE & Controls Use solvent-rated gloves and eye protection. Ensure adequate ventilation and have spill kits ready. Label waste containers for used grease and dispose of all materials according to local environmental regulations. Step-by-Step Procedure: Replacing Grease Safely Phase Key Actions Validation Requirement 1. Preparation Gather approved solvents, lint-free wipes, and candidate grease. Isolate equipment (LOTO). Verify authorized equivalent via engineering approval. 2. Removal Full cleaning of cavity. Take grease sample for laboratory archiving if compatibility is uncertain. Visual confirmation of zero debris/old residue. 3. Application Apply substitute per volume guidance (typically 10–20% of cavity volume). Use calibrated dispensers to prevent overpacking. 4. Validation Perform controlled run-in. Monitor temperature and vibration trends. Baseline readings logged in maintenance record. Testing & Verification Immediate inspections should occur within the first 10–50 operating hours. Focus on temperature trends and abnormal acoustic signatures. For long-term monitoring, send samples for laboratory analysis using the following parameters: FTIR for contamination and base-oil identification Kinematic viscosity (cSt) and dropping point (°C) Elemental analysis for wear metals (ppm) Escalation Triggers Escalate to engineering or OEM approval if: Component is safety-critical or flight-essential. System is sealed with "lifetime" grease. Substitute changes thickener chemistry (e.g., Lithium to Polyurea). Operational limits are exceeded during run-in. Common Questions (FAQ) How do I confirm a grease is a safe cross reference? + Confirm by comparing base-oil type, thickener chemistry, NLGI/viscosity, dropping point, and additive function. If any critical property differs, obtain lab compatibility testing or engineering approval before use. What lab tests should I request after a substitution? + Request FTIR for base-oil ID and contamination, kinematic viscosity at 40°C, dropping point, and elemental analysis for wear metals. Include a baseline sample from the original grease when possible to enable direct comparison. When should I revert to the original grease after replacement? + Revert if operating temperatures, vibration, or wear metrics exceed expected thresholds, or if lab analysis shows incompatible chemistry. Re-clean the cavity before re-applying the approved grease to avoid residual mixing. ✓ Pre-Job Quick Checklist ☐ Confirm 413586-1 spec and permitted substitutes. ☐ Verify full-clean requirements and secure solvents. ☐ Confirm PPE, tools, and calibrated dispensers. ☐ Log planned substitution and hold points. ☐ Sample taken and labeled. ! Troubleshooting Guide Excess Heat: Verify correct volume; check for contamination; consider re-cleaning. Noise/Vibration: Inspect for foreign particles; repeat torque and alignment checks. Leakage: Confirm seal compatibility with substitute base oil; replace seals if necessary. Key Summary Safe grease substitution follows a clear path: verify the specification, clean thoroughly, match critical properties, follow a controlled replacement procedure, then test and monitor performance. Correct cross-referencing protects safety and uptime—document every substitution and use the pre-job checklist and inspection log to maintain traceability. When in doubt, stop and escalate to engineering or request lab confirmation.

Data-driven hook: Consolidated lab and datasheet metrics—VSWR, insertion loss, isolation, and mechanical mating cycles—are the fastest way to judge RF connector suitability. This article gathers and interprets available performance data for the 1221887-1 to help engineers compare specs, validate test methods, and make deployment decisions. The focus is on measured versus datasheet metrics so teams can align requirements, test plans, and acceptance criteria before production. Practical guidance below targets board-level RF engineers and test lab leads who need reproducible, calibrated measurements and clear mechanical validation. Where datasheets omit values, the text flags “[not specified — test recommended]” and recommends standardized lab procedures to produce repeatable performance data for qualification. Background: Part overview & intended use What the 1221887-1 identifies (use-case scope) Point: The pickup for an OSP style RF connector is its family, mounting, impedance, and targeted uses. Evidence: OSP connectors are typically board-edge or end-launch 50 Ω interfaces intended for board-level RF, test-jig hookups, and sealed feedthroughs when a hermetic variant exists. Explanation: Document the connector family as OSP, mount type as board-edge/end-launch, nominal impedance 50 Ω, and primary applications—bench test, RF I/O, or feedthrough—so readers immediately map the part to system needs. Key datasheet fields to extract Point: A consistent datasheet extraction checklist improves comparisons. Evidence: Capture frequency range, VSWR, insertion loss, return loss, impedance, power rating, dielectric material, plating, mating cycles, torque, temperature/humidity limits, and sealing rating. Explanation: Tag missing fields with “[not specified — test recommended]”; use secondary search phrases like “1221887-1 specs” and “OSP connector electrical specs” when organizing file names and test reports. Performance Data Summary (measured & datasheet) Point: Presenting electrical and mechanical metrics side-by-side makes acceptance decisions straightforward; here we consolidate the most crucial performance data for the OSP RF connector and show how to note test conditions. Evidence: The tables below contrast datasheet claims and representative lab measurements with explicit calibration and fixture notes. Explanation: Always state system impedance (50 Ω), calibration type, cable lengths, and de-embedding steps when reporting VSWR or insertion loss. Electrical performance snapshot Electrical summary (example) Frequency band VSWR (datasheet) VSWR (measured) Insertion loss (dB) Notes 0.1–1 GHz ≤1.3 1.25 0.05 SOLT, 50 Ω, 30 cm cable 1–6 GHz ≤1.5 1.45 0.15 Board-launch de-embedded 6–18 GHz [not specified] 1.8 0.8 Fixture-limited above 12 GHz Mechanical & environmental performance snapshot Mechanical / Environmental summary (example) Test Datasheet rating Lab result Pass/Fail Notes Mating cycles 500 cycles 500 cycles, ΔR PASS Contact wear within tolerance Retention force 1.2 N 1.1 N MARGINAL Board solder fillet influence Thermal range -40 to 85 °C -40 to 85 °C PASS No sealing degradation Detailed Electrical & Mechanical Specs (how to document) Exact specs to capture from datasheet • Characteristic impedance (50 Ω) • Frequency range & Max VSWR • Insertion loss per GHz • Dielectric strength (V) & Plating material Recommended measurement methods Steps: SOLT VNA calibration, document fixture S-parameters, apply de-embedding for board launches, condition samples in temperature chamber, and perform mechanical cycle testing with contact resistance logging. Acceptance: VSWR Installation, Test Procedures & Validation Assembly & board-mount best practices Point: Installation technique influences long-term RF performance. Evidence: Guidance includes careful board-edge handling, follow reflow profiles that avoid overheating contacts, controlled torque with a calibrated driver, anti-rotation features, and cleanliness protocols. Explanation: Maintain cleanliness (solvent swab where allowed), avoid lubricants unless specified, and log torques and solder fillet quality because contamination or improper torque often leads to degraded VSWR or intermittent contact noted in subsequent performance data. Sample test log fields Field Example entry Sample IDS123-1221887-1-A Calibration fileSOLT_2025_001 Fixture IDF-BoardEdge-01 Pre-test VSWR1.25 @ 3 GHz Applications, Comparisons & Troubleshooting Typical use cases & selection tips For bench test jigs prioritize ease of mating and low repeatable insertion loss; for PCB RF I/O prioritize solder/board robustness; for sealed feedthroughs prioritize sealing and temperature rating. Use the 1221887-1 where board-edge testability and moderate frequency performance are primary. Common failure modes & fixes Typical symptoms include elevated VSWR after cycling, intermittent contact, and cracked solder fillets. Corrective actions: re-torque or replace worn contacts, clean mating surfaces with approved solvents, and adjust PCB keepout geometry. Summary 1 Capture datasheet values for impedance, VSWR, insertion loss, and mechanical ratings for 1221887-1 to establish baseline acceptance criteria and identify gaps that require lab testing. 2 Validate electrical performance with a calibrated VNA (SOLT), document fixture and de-embedding steps, and record insertion loss/VSWR across the stated frequency range for the OSP RF connector. 3 Perform mechanical cycling and environmental soak tests, log contact resistance and retention force, and use the provided tables and test log to record pass/fail decisions. Additional publishing guidance (brief) Point: Allocate words and visuals to maximize clarity and SEO while preserving technical depth. Evidence: Suggested allocation for a 900-word article: Intro ~10–12%, five H2s split evenly across body ~75–80%, Summary ~10%; include two tables and captions for key figures. Explanation: Use long-tail phrases like “1221887-1 insertion loss” in captions and maintain consistent units (50 Ω system, SOLT calibration) to aid discoverability and reproducibility. Frequently Asked Questions Q: What is the expected VSWR for the 1221887-1? Typical datasheet VSWR targets are specified per frequency band; if unspecified, define lab acceptance (e.g., VSWR Q: How often should performance data be re-validated? Re-test intervals depend on application risk: for high-use test jigs validate every 250–500 cycles, for field I/O validate after thermal excursions or firmware updates that change operating conditions. Track trends in contact resistance and VSWR to trigger earlier requalification. Q: What to do if insertion loss increases after environmental testing? Investigate connector plating wear, dielectric changes, and board-level stress; perform visual inspection, contact resistance checks, and controlled reflow of suspect assemblies. If root cause is connector wear, replace and update mating cycle limits in specifications.

This article delivers a consolidated, data-first reference for the 1361579-1 SMB connector so engineers can validate design and procurement decisions without hunting multiple sources. It lists measurable items up front — typical RF performance ranges, mechanical dimensions, crimp and assembly tolerances, and common test results — followed by tables and measurement tips to speed verification. The summary below combines electrical tables, recommended PCB footprints, crimp dimensions, test setups and procurement checklists so a hardware team can cross-check supplier datasheets and run bench verification efficiently. Keywords: 1361579-1, SMB connector, datasheet. Product Overview & Typical Applications What 1361579-1 is and where it's used Point: The 1361579-1 is a PCB-mount SMB form-factor RF connector family optimized for quick mating and compact RF routing. Evidence: Typical use cases include RF patch leads, board-mounted RF I/O and test connectors on coax harnesses. Explanation: Engineers select this SMB connector where small footprint, sub-GHz to several-GHz operation and repeatable quick connects are required; common systems include test fixtures, handheld radios and cable assemblies where 50/75 ohm matching is specified. Key selection criteria for engineers Point: Key practical criteria are impedance match, usable frequency range, rated mating cycles, and mounting style. Evidence: Impedance (50 vs 75 ohm) and frequency define insertion loss; mating cycles and plating affect reliability. Explanation: Prioritize impedance and frequency first, then trade off plating (gold for contact reliability) versus cost, and choose vertical or right-angle mounting to meet space and footprint constraints. Complete Electrical Specifications RF Performance Data Point: RF performance tables give the practical envelope engineers use for link budgets and return-loss budgeting. Frequency Range: DC - 2.5 GHz (Typical) Max Bandwidth: Up to 4.0 GHz Parameter Typical Max / Notes Impedance 50 Ω (typical) Also available in 75 Ω variants Frequency range DC – 2.5 GHz Up to 4 GHz in optimized assemblies Maximum VSWR ≤1.5:1 (typ at low band) ≤2.0:1 at upper band depending on assembly Insertion loss 0.1–0.6 dB (per connector at 1 GHz) Increases with frequency and poor mating Electrical Ratings Point: Electrical ratings determine safe operating envelopes and test requirements. Evidence: Typical acceptance thresholds: contact resistance ≤10–20 mΩ, insulation resistance ≥1 GΩ at rated voltage, working voltage in low-voltage RF range. Explanation: Confirm contact resistance and insulation tests in the supplier datasheet before production; specify test voltages (e.g., 500 V DC megger for insulation) and contact resistance measurement method (four-wire) in purchase specs. Mechanical Specifications & Drawings Dimensional Guidance Point: Accurate mechanical tables and a recommended PCB land pattern reduce assembly rework. Dimension Typical (mm) Notes Overall length 12.0 PCB-mounted to mating face Body OD 4.5 Reference for keep-out Center pin protrusion 1.2 Ensure solder fillet coverage Materials, Plating, & Durability Point: Materials and plating drive wear and corrosion resistance. Evidence: Contacts commonly use copper alloys with gold or tin plating; insulators are PTFE or high-temp plastics. Explanation: Gold plating increases mating-cycle life and lowers contact resistance; typical mating life is 500–1000 cycles depending on plating and handling — verify manufacturer’s durability testing for your expected field cycles. Crimping, Assembly & Mounting Best Practices Crimp dimensions, wire prep & tooling notes: Correct crimp geometry and wire prep are essential for low-loss, durable cable terminations. Wire / Contact Strip (mm) Crimp OD (mm) Center conductor 3.0 — Shield braid 5.0 1.8 PCB Soldering & Reflow Point: Solder profile and mechanical retention prevent joint failure during thermal cycling. Use controlled preheat and limit peak temperature per connector material; provide anchors or adhesives if vibration expected. If reflow is used, confirm connector thermal rating; otherwise hand-solder or wave solder per supplier guidance. Test, Verification & Environmental Performance Recommended Bench Tests Essential tests: calibrated VSWR/return loss (VNA), insertion loss, continuity, contact resistance (four-wire), and mechanical mating force. Use a calibrated VNA with a suitable test fixture; record both raw and fixture-de-embedded results. Pass/fail criteria: VSWR ≤1.5:1 typical. Environmental & Reliability Common tests: thermal cycling (-40°C to +85°C), vibration per relevant profile, humidity soak, and salt spray for plated parts. Typical acceptance: no electrical opens, ≤10% change in contact resistance, and maintained VSWR within spec. Procurement Checklist & Compliance How to verify part authenticity and equivalence: Compare mechanical drawings, electrical tables, materials/plating notes, and crimp dimensions side-by-side. Require supplier PDFs of the datasheet and dimensional drawings; confirm pin-to-pin spec matching and plating thickness. Compliance, labeling and ordering tips: Confirm regulatory and traceability items at purchase time. Ask for RoHS/REACH declarations, packaging options, and lot traceability test reports. Include the word "datasheet" in procurement requests to ensure you receive full test tables. Key Summary ✔ Consolidated electrical and mechanical tables give quick pass/fail checkpoints for the 1361579-1 and equivalent SMB connector candidates. ✔ Confirm impedance, frequency band, VSWR, and contact resistance against system budgets before finalizing footprint and assembly methods. ✔ Use the crimp and PCB tables to verify tooling compatibility and solder/reflow limits; add mechanical anchors for high-vibration use. ✔ Run VNA-based VSWR/insertion-loss tests with fixture de-embedding, and request supplier environmental test reports prior to large buys. Conclusion This guide consolidates the electrical tables, mechanical drawings, assembly best practices and test methods engineers need to evaluate SMB connector candidates efficiently. Next steps: compare these summarized values against the supplier PDF, execute the recommended bench tests, and apply the procurement checklist before production purchases to reduce risk and rework. FAQ Section ▶ What electrical tests should I run on an SMB connector before production? Run calibrated VNA tests for VSWR and insertion loss with fixture de-embedding, four-wire contact resistance, continuity and a mechanical mating-cycle check. Establish pass/fail thresholds up front and document fixture correction so supplier and production results are comparable. ▶ How do I verify crimp quality for shielded coax terminations? Inspect for full metal flow and no dielectric nicking, measure crimp outer diameter against the crimp-dimension spec, perform a pull test per spec (e.g., defined Newtons), and verify electrical continuity and low contact resistance. ▶ Which mechanical support methods prevent solder-joint fatigue for board-mounted RF connectors? Use mechanical anchors, PCB staking pads, or epoxy fillets to take shear loads off solder joints. Design adequate keep-out areas and include mechanical retention features in the footprint to minimize stress from repeated mating cycles.