The TE Connectivity 6-1393670-0 is specified as a 75 ohm DIN 1.0/2.3-style RF connector commonly used in downstream broadcast and RF distribution equipment. Engineers choose this part for compact form factor and controlled impedance when attaching small coax such as RG‑174; this introduction highlights its core specs and a practical testing roadmap to verify performance on the bench and in production. The following sections summarize mechanical choices, electrical specs, impedance behavior, and step‑by‑step VNA/TDR validation procedures so teams can set clear pass/fail criteria.
Point: The connector follows the DIN 1.0/2.3 form factor in a compact plug/jack family designed for free‑hanging or inline cable assemblies. Evidence: Typical assemblies accept small coax such as RG‑174 and offer solder and crimp contact terminations with shield termination provisions at the rear. Explanation: For space‑constrained applications the small OD and threaded/mating shell ensure repeatable mating; choice of crimp vs. solder affects mechanical strain relief and RF continuity at the shield.
Point: This connector is prevalent in broadcast set‑top boxes, cable modems, and test instrumentation. Evidence: Systems that require 75 ohm matching across cable runs rely on DIN 1.0/2.3 variants to minimize reflections when mating to 75 ohm coax. Explanation: Maintaining a 75 ohm signal chain reduces return loss and prevents visible artifacts in downstream video or RF measurements, which is why OEMs often standardize on this footprint for high‑density RF I/O.
Point: Critical datasheet entries are DC contact resistance, working voltage, insulation resistance, contact material/finish, and stated 75 ohm characteristic impedance. Evidence: Contact plating (e.g., gold over nickel) and dielectric geometry determine low‑frequency resistance and high‑frequency loss. Explanation: Engineers should interpret listed typical vs. maximum values—typical DC resistance indicates expected loss at low frequencies, while max ratings bound worst‑case behavior; the stated 75 ohm is the design target for characteristic impedance across the mating interface.
Point: Mechanical durability, temperature range, and mounting style influence long‑term RF stability. Evidence: Specified mating cycles and operating temperature ranges indicate resilience to thermal cycling and mechanical wear. Explanation: Repeated mating can cause shield deformation or contact wear, which shifts impedance at the interface; verifying durability and environmental limits guards against gradual return loss degradation in fielded products.
Point: Characteristic impedance is a frequency‑dependent property that ideally remains near 75 ohms across the intended band. Evidence: Practical S11 and VSWR traces from small coax connectors typically show best matching at lower RF bands with modest deviations at higher frequencies. Explanation: Measuring S11 (return loss) with a VNA over the planned operational span reveals whether the connector and mating geometry preserve 75 ohm behavior; small dielectric or dimensional changes introduce frequency‑dependent impedance steps.
Point: Mismatch creates reflections, insertion loss changes, and degraded signal integrity. Evidence: Visible symptoms include elevated return loss, spurious notches in swept response, and increased VSWR leading to reduced power transfer. Explanation: In broadcast systems, reflections can produce multipath‑like artifacts or bit‑errors in digital streams; knowing when the connector is the limiting element (versus cable or adapter) directs corrective action.
Point: A calibrated VNA and TDR are the core instruments for RF verification. Evidence: Use SOLT or TRL VNA calibration with calibrated test cables and short, open, load, and through references; TDR helps localize impedance steps. Explanation: Proper fixturing and de‑embedding of test adapters remove fixture contribution so measurements represent the connector under test; a stable lab environment and traceable calibration improve repeatability between lots.
Point: Combine visual, VNA, and TDR checks in a documented workflow. Evidence: Typical sequence—(1) visual/continuity and torque checks; (2) VNA sweep for S11 and insertion loss across the device bandwidth; (3) TDR to verify a nominal 75 ohm profile through the mating interface. Explanation: Target metrics commonly used are S11
| Parameter | Typical Value |
|---|---|
| Characteristic impedance | 75 Ω |
| Mating style | DIN 1.0/2.3 plug/jack |
| Contact termination | Crimp or solder |
| Cable compatibility | RG‑174, similar small coax |
| Operating temp | Industry typical range (refer to datasheet) |
Point: Choose crimp for consistent, repeatable assembly; choose solder where space or custom prep requires it. Evidence: Properly sized crimp dies and controlled solder temperature prevent conductor damage and maintain shield continuity. Explanation: Follow precise strip lengths and shield termination patterns to keep the conductor centered and the dielectric undisturbed; improper prep is a common source of impedance steps at the interface.
Point: Common failures include loose shields, corrosion, or crushed dielectrics. Evidence: Symptoms—elevated return loss, intermittent continuity, or visible deformation. Explanation: Field isolation tests (continuity and simple TDR) quickly indicate whether the problem is mechanical or dielectric; corrective actions often involve retermination, replacement of damaged boots, or corrosion treatment.
Point: DIN 1.0/2.3 families have compatible mating jacks and several part variants. Evidence: When substituting, match mating style, impedance, and mechanical retention. Explanation: Cross‑referencing requires comparing mechanical drawings and impedance statements to ensure direct replacements do not introduce unintended reflections or mechanical fit issues.
Point: Inspect incoming lots and watch MOQ and counterfeit risk. Evidence: Implement incoming inspection sample plans and quick VNA spot checks on new lots. Explanation: Requiring traceable lot testing and documented acceptance criteria reduces production risk and prevents field failures tied to poor batches or nonconforming substitutes.
The TE Connectivity 6-1393670-0 is a compact 75 ohm DIN 1.0/2.3 RF connector with clear mechanical and electrical specs; confirming impedance via VNA and TDR and following disciplined assembly best practices preserves signal integrity. Proper inspection, calibration, and documented pass/fail criteria ensure repeatable performance in broadcast and RF distribution products while minimizing field issues related to termination or mechanical wear.
Run a calibrated VNA sweep with de‑embedded fixtures to measure S11 across the intended band and perform a TDR to verify a continuous ~75 ohm trace; set batch acceptance limits (e.g., S11
Perform visual inspection, continuity checks of center and shield, and a handheld TDR or VNA spot check to differentiate mechanical failures from cable or system faults; reterminate or replace suspect connectors as needed.
Crimp termination with properly matched dies and process control generally delivers the most repeatable RF continuity and mechanical reliability; where solder is required, strict temperature and soldering procedures reduce dielectric and conductor damage risks.
Standard test report template (example fields): - Part number: __________________ - Lot number: ___________________ - Equipment used: VNA model / TDR model - Calibration method: SOLT / TRL - S11 @ freq range: _______ to _______ - Peak S11 (dB): ______ - VSWR max: ______ - TDR profile notes: __________________ - Pass/Fail: ______ Comments: __________________